High performance integration of electronic components in an overmoulding

The successful integration of electronic components in an overmould is directly related to the level of dynamic forces, temperatures and pressures reached during the injection process.
dynamic forces, temperatures and pressures reached during the injection process.

The Assytronic project, carried out between the iRAP institute and 8 industrial partners who are members of the Swiss Plastics Cluster, highlights the concrete possibilities of direct overmoulding of mechatronic elements thanks to a good control of the different variables.

Five case studies specific to the demands of some of the industrialists have been developed and studied independently.

To find out more, read the article

Temperature vs. time evolution of an RFID during ABS overmolding.

Temperature vs. time evolution of an RFID during ABS overmolding.

9 September 2021

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